Our Capabilities:
Our capabilities include all surface-mount and through-hole technologies currently on the market.
The smallest component size that can be placed by our automated machines are 0201 (0.25mm x 0.125mm).
Anything smaller can still be placed manually with relative ease, but unfortunately at a much slower pace....
Services that we do not currently offer are Bare-Silicon Die gold and aluminium wire bonding and epoxy encapsulation, but we are hoping to establish the equipment and material handling facilities in the near future, depending only on enough interest and demand.
Our capabilities include all surface-mount and through-hole technologies currently on the market.
The smallest component size that can be placed by our automated machines are 0201 (0.25mm x 0.125mm).
Anything smaller can still be placed manually with relative ease, but unfortunately at a much slower pace....
Services that we do not currently offer are Bare-Silicon Die gold and aluminium wire bonding and epoxy encapsulation, but we are hoping to establish the equipment and material handling facilities in the near future, depending only on enough interest and demand.
